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Infineon Technologies S29GL256P11FFIV23 — Discrete Semiconductors

Infineon S29GL256P11FFIV23 NOR Flash, 256 Mbit, 110 ns

MPNS29GL256P11FFIV23
End of Life

Infineon Technologies GL-P series NOR Flash, 256 Mbit, Parallel interface, 110 ns access, 1.65-3.6 V, -40 to +85°C, 64-FBGA (13x11 mm), ROHS3.

$9.82Ref. price · indicative, final on quote
Packaging64-LBGA
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

S29GL256P11FFIV23 Technical Specifications
ParameterValue
SeriesGL-P
Memory typeNon-Volatile
Mounting typeSurface Mount
Voltage1.65V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
TechnologyFLASH - NOR
Access time110 ns
Memory size256Mbit
Memory formatFLASH
Case64-LBGA
Memory organization32M x 8
Write cycle time - word, page110ns

Product details

Active production — no last-time-buy pressure

The S29GL256P11FFIV23: ROHS3 compliance is confirmed, so the part meets the current EU RoHS exemption level without requiring a separate waiver.

256 Mbit NOR flash — what the organization means for your firmware

Organized as 32M x 8 bits, the 256 Mbit array gives you 32 MB of byte-addressable code storage. The parallel interface reads at the full bus width on every cycle, so random-access latency stays at the 110 ns access time — no serial shift-out delay. The write cycle time matches the access time at 110 ns for word and page operations, which means programming a full page takes roughly that per word before the next write cycle starts. Budget this into your firmware update routine.

This simplifies the power tree and saves a BOM line when the rest of the system already runs at one of those voltages.

Industrial temperature grade and 64-FBGA package

The 64-FBGA package measures 13x11 mm with a 1.0 mm ball pitch typical for this class. The BGA footprint requires a solder-paste stencil and reflow profile matched to the package moisture sensitivity level — confirm the MSL before opening the reel.

Frequently asked questions

What is the memory organization and access time of this flash?

The 256 Mbit array is organized as 32M x 8 bits with a 110 ns access time and a matching 110 ns write cycle time for word and page operations. The parallel interface reads the full byte on every cycle.