512 Mbit NOR Flash with Quad-SPI at 133 MHz
24-ball BGA — layout and assembly considerations
Housed in a 24-ball TBGA (6 mm x 8 mm body), this part demands a controlled reflow profile per JEDEC MSL rating (verify on the reel label). The 0.8 mm ball pitch eases routing on a 4-layer board, but the BGA footprint requires X-ray inspection for solder joint integrity after reflow. Decoupling with a 100 nF capacitor per supply pin pair, placed within 2 mm of the BGA footprint, keeps the core supply clean during Quad-SPI bursts at 133 MHz.