Infineon FL-S Series S25FL512SAGBHV313, 512 Mbit NOR Flash, SPI - Quad I/O, 133 MHz, 2.7V-3.6V, -40°C to 105°C, 24-TBGA Tape & Reel.
| Parameter | Value |
|---|---|
| Series | FL-S |
| Memory type | Non-Volatile |
| Mounting | Surface Mount |
| Supply voltage | 2.7V ~ 3.6V |
| Clock frequency | 133 MHz |
| Memory interface | SPI - Quad I/O |
| Operating temperature | -40°C ~ 105°C (TA) |
| Package | Tape & Reel (TR) |
| Technology | FLASH - NOR |
| Memory size | 512Mbit |
| Memory format | FLASH |
| Case | 24-TBGA |
| Memory organization | 64M x 8 |
Packaged in a 24-TBGA (6x8 mm body), the S25FL512SAGBHV313 requires a BGA fanout pattern with microvias or blind vias for the inner balls. The supplier device package is 24-BGA (6x8).
Within the same FL-S family, the S25FL512S series includes multiple ordering codes that differ by package (BGA vs SOIC), temperature grade, and packaging medium (Tray vs Tape & Reel). The S25FL512SAGBHV313 is the 24-ball BGA, industrial temperature, Tape & Reel variant. A pin-compatible alternative with the same density and interface would be another S25FL512S device in the same BGA package and temperature grade — confirm the exact suffix for your assembly process.