Supply rails and temperature — where it lives on the board
At 105°C ambient, derate the read current from the typical 25°C value; the datasheet's thermal impedance for the 16-SOIC wide body is your guide for airflow requirements.
The 16-SOIC wide body is one of the friendlier packages to rework. The 1.27 mm pitch gives you room to get a fine-tip iron or hot-air nozzle between pins without bridging. The wide body has more thermal mass than the narrow SOIC, so set your hot-air station to 320°C at moderate airflow and preheat the board from underneath to 100°C; the part will lift clean after about 30 seconds. No underfill to deal with, no hidden pads.