256 Mbit NOR Flash in a 24-BGA package
The S25FL256SAGBHV203 is a 256 Mbit SPI NOR Flash from Infineon's FL-S series, organized as 32M x 8 bits.
Reworking the 24-BGA on the bench
The 24-BGA package (8x6 mm body) has a 0.80 mm ball pitch — tight enough to need a pre-heat plate and a reflow profile that matches the JEDEC moisture sensitivity level. The supplier device package is 24-BGA (8x6 mm). The balls are SAC305 solder; the reflow peak should stay under 260°C to avoid popcorning the die. The -40°C to 105°C industrial temperature range means the flash is rated for outdoor or engine-bay environments where the ambient sees thermal cycling. The package itself is rated for that range, not just the silicon.