256Mbit SPI NOR — AEC-Q100 qualified for under-hood temperature range
The S25FL256SAGBHMC00: At 133 MHz clock frequency via the Quad I/O SPI interface, it delivers sustained read throughput for code shadowing or data logging in engine-control and ADAS modules.
Package footprint and board integration
Supplied in a 24-ball TBGA (8x6 mm body) — the 0.80 mm ball pitch requires a 4-layer PCB for fan-out, with the thermal pad on the backside of the package soldered to a ground plane for heat spreading. The tray packaging is standard for automated pick-and-place; the moisture sensitivity level should be verified from the latest Infineon PCN for bake requirements before reflow.