The 256 Mbit density (32 MB) holds a full bootloader, RTOS image, and a modest OTA staging area. For designs that already run a 3.3V SPI bus, this part adds no level-shifting cost.
Package and footprint — 24-BGA (6x8 mm)
Housed in a 24-ball BGA measuring 6x8 mm (supplier device package 24-BGA), this is a surface-mount part intended for reflow assembly. The fine-pitch BGA requires controlled solder-paste volume and X-ray inspection post-reflow — not a hand-solder part. The 2.7V to 3.6V supply rail is standard for 3.3V Flash; decoupling with a 100 nF ceramic within 2 mm of the VCC ball is the usual starting point.
