The S25FL256SAGBHI200: It communicates over a SPI interface with Quad I/O support, clocked at 133 MHz. The 24-TBGA package (8x6 mm body) is a space-saving BGA footprint suited for compact embedded systems where board area is tight.
Quad SPI throughput and bus margin
For a system engineer, that means the flash can sustain code-execute-in-place (XIP) or fast firmware boot without stalling the CPU. The 2.7V to 3.6V supply range aligns with standard 3.3V logic rails and also tolerates a 2.8V battery-backed supply in portable or backup scenarios.
For a BOM that needs a stable NOR Flash supply for the next several years, this is a current-production device suitable for new designs. The ROHS3 compliance is standard for European and global markets.
24-BGA footprint and layout notes
The 24-ball TBGA package (8x6 mm) is a fine-pitch BGA. For the PCB layout engineer: the ball pitch is 0.8 mm typical for this form factor, requiring via-in-pad or microvia fanout for the Quad SPI signals. Keep the SPI trace lengths matched within 10 mm to avoid skew at 133 MHz. Decouple with a 100 nF ceramic near each supply ball — the 2.7V–3.6V rail is shared with the core and I/O, so a clean supply is critical for signal integrity on the Quad lines.