Infineon FL-S series, 256Mbit NOR Flash, SPI Quad I/O, 133 MHz, 2.7-3.6V, 24-TBGA (8x6 mm), -40 to 85°C, Automotive AEC-Q100, Tape & Reel.
| Parameter | Value |
|---|---|
| Series | Automotive, AEC-Q100, FL-S |
| Memory type | Non-Volatile |
| Mounting | Surface Mount |
| Supply voltage | 2.7V ~ 3.6V |
| Clock frequency | 133 MHz |
| Memory interface | SPI - Quad I/O |
| Operating temperature | -40°C ~ 85°C (TA) |
| Package | Tape & Reel (TR) |
| Technology | FLASH - NOR |
| Memory size | 256Mbit |
| Memory format | FLASH |
| Case | 24-TBGA |
| Memory organization | 32M x 8 |
The S25FL256SAGBHA203: Housed in a 24-TBGA (8x6 mm) package, the device requires a surface-mount reflow profile consistent with JEDEC MSL ratings for BGA packages. The 24-ball grid array footprint demands X-ray inspection after reflow to verify solder joint integrity, particularly for automotive production runs where process control is critical. Tape & Reel packaging supports automated pick-and-place assembly at volume.
Within the Infineon FL-S family, the S25FL128S and S25FL512S series share the same 24-BGA footprint and Quad SPI interface, differing only in density (128 Mbit and 512 Mbit respectively). Verify the exact density your BOM requires before substituting.