256Mbit automotive NOR Flash with Quad SPI at 133 MHz
The memory is organized as 32M x 8 bits and operates from a 2.7V to 3.6V supply rail.
125°C rating and BGA footprint — design-in notes
The 24-TBGA (6x8 mm) package uses a 24-ball array with a 0.8 mm pitch — plan the via fanout under the BGA for the Quad SPI signals and a clean decoupling cap placement within 2 mm of the supply balls. Surface-mount only; no through-hole alternative in this package variant.
For dual-sourcing flexibility, the same die in a different package — S25FL256LAGMFM000 (24-BGA, same temp range) — is a direct functional equivalent, differing only in the shipping medium (Tray vs Tape & Reel).