The S25FL164K0XBHVS23: Infineon lists this part as Obsolete. Sourcing runs through independent distribution — quantities are lot-specific and confirmed at RFQ. For a BOM line that already carries this footprint and interface, the surplus channel is the practical path.
Housed in a 24-ball TBGA (8 mm x 6 mm body), the 0.80 mm ball pitch requires a controlled-impedance PCB stack-up for the Quad SPI traces at 108 MHz. The -40 °C to 105 °C rating means the device is qualified for the full industrial temperature envelope — no derating needed for ambient up to 105 °C.