Package and board integration — 24-BGA 6x8 mm
The S25FL164K0XBHV030: Housed in a 24-ball TBGA (6x8 mm) package for surface-mount assembly, the 0.80 mm ball pitch demands controlled impedance routing on a multi-layer board to maintain signal integrity at the 108 MHz quad-I/O data rate. The supply decoupling strategy should place a 100 nF MLCC within 2 mm of each VDD ball pair, with a bulk 10 µF capacitor per voltage plane section, to keep the core voltage ripple below 50 mV during simultaneous quad-read bursts.