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Infineon Technologies S25FL129P0XBHV310 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL129P0XBHV310 NOR Flash 128Mbit SPI Quad I/O, 104 MHz, Obsolete

MPNS25FL129P0XBHV310
Obsolete

Cypress FL-P series S25FL129P0XBHV310, 128 Mbit NOR Flash, SPI Quad I/O interface, 104 MHz clock, 2.7-3.6 V supply, -40 to 105 °C industrial temp, 24-BGA (6x8 mm) tray.

Infineon Technologies S25FL129P0XBHV310 datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

S25FL129P0XBHV310 specifications
ParameterValue
SeriesFL-P
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Clock frequency104 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C~105°C(TA)
PackageTray
TechnologyFLASH - NOR
Memory size128Mbit
Memory formatFLASH
Case24-TBGA
Memory organization16M x 8
Write cycle time - word, page5µs, 3ms

Product details

Package and footprint — 24-BGA 6x8 mm

The 24-ball BGA package measures 6 mm x 8 mm. That is a compact footprint but requires a multilayer PCB with via-in-pad or microvia capability for routing the SPI signals out from under the device. The ball pitch is not listed here, but the 24-ball array on a 6x8 mm body implies a fine-pitch layout — verify the landing pattern against the Cypress application note for the FL-P series before committing the board. Surface-mount only; no socket option for this package.

Frequently asked questions

What is the closest pin-compatible alternative to S25FL129P0XBHV310?

The FL-P series includes higher-density or lower-voltage variants that are pin-compatible across the 24-BGA package option. Check the Cypress FL-P family datasheet for the specific density and voltage grade that matches your BOM.

What series is S25FL129P0XBHV310 from?

It belongs to the Cypress FL-P series of SPI NOR Flash memory.

What package does S25FL129P0XBHV310 use?

It is supplied in a 24-ball TBGA package, 6 mm x 8 mm body, on tray.