Obsolete — sourcing reality for this line item
Package and footprint — what the 24-BGA means for the board
The 24-BGA (6x8 mm) package is a fine-pitch ball-grid array. That drives a four-layer PCB minimum for fanout; two-layer boards won't route the signals without vias under the package. Verify the PCB land pattern against the Cypress application note for this package before committing the layout.
Write-cycle timing — page and word program
Word program time is 5 µs typical; page program runs 3 ms typical. For field firmware updates over SPI, budget the write time into the update sequence; the host MCU should poll the status register rather than inserting fixed delays.