It uses a SPI Quad I/O interface running at 133 MHz, organized as 16M x 8 bits, and operates from a 2.7V to 3.6V supply.
For a 32-bit MCU booting from this flash, the read latency and burst performance determine whether the code can execute in place (XIP) or needs a shadow copy to RAM. The Quad SPI mode reduces the pin count compared to a parallel NOR interface, which saves board area and routing layers in a dense automotive ECU.
AEC-Q100 qualification: what it buys you
For a Tier-1 supplier submitting a PPAP package, using an AEC-Q100 listed component avoids the need for separate qualification data.
Package and mounting: 8-WSON with exposed pad
The 8-WDFN Exposed Pad package (supplier device package 8-WSON 6x8) is a surface-mount, leadless design. This draws heat from the die during continuous read operations at high ambient temperatures. The pad also serves as a ground return for the SPI signals, so a solid via stitch under the package improves signal integrity at 133 MHz.
No PCN or EOL bulletin is flagged for this order code at the time of writing.