It speaks SPI with Quad I/O at up to 133 MHz. NOR flash gives byte-addressable random access and fast read latency, which makes this part suitable for execute-in-place (XiP) firmware storage, boot code, and parameter tables. The 128 Mbit density holds a substantial firmware image plus an OTA staging area or a file system.
Package and assembly constraints
The device comes in a 24-ball TBGA (8 x 6 mm body). BGA packages require solder-paste stencil, reflow profile control, and X-ray inspection.
