The S25FL128SAGBHID03 communicates over a Quad-SPI interface at up to 133 MHz, with an 8 ns access time.
It comes in a 24-ball TBGA (8x6 mm body), surface-mount only. No exposed thermal pad — the package dissipates through the balls and the board plane.
Not qualified for under-hood automotive (no AEC-Q100 mark), but fine for cabin or infotainment modules that stay inside that window.
Listed as Active by Cypress, so no end-of-life notice is in effect.
