It comes in a 24-ball TBGA package measuring 8x6 mm — a fine-pitch BGA that needs a reflow oven and X-ray inspection for assembly; this is not a socketed part you swap in the field.
133 MHz Quad SPI — sizing the read bandwidth
Infineon lists the S25FL128SAGBHI210 as Active. The base product number S25FL128 covers a range of density and package variants; if you need a different package or temperature grade later, the family is broad enough to shift within.
BGA assembly — plan for reflow, not a socket
The 24-TBGA (8x6 mm) package is a fine-pitch ball grid array. It requires a reflow profile, X-ray inspection for solder joints, and a stencil design matched to the ball pitch.