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Infineon Technologies S25FL064P0XBHIS30 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL064P0XBHIS30 64Mbit NOR Flash, SPI Quad I/O, 104 MHz

MPNS25FL064P0XBHIS30
Obsolete

Infineon FL-P series S25FL064P0XBHIS30, 64Mbit FLASH - NOR, SPI - Quad I/O interface, 104 MHz clock frequency, 2.7V~3.6V supply, -40°C~85°C, 24-TBGA package.

Infineon Technologies S25FL064P0XBHIS30 datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

S25FL064P0XBHIS30 specifications
ParameterValue
SeriesFL-P
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Clock frequency104 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C~85°C(TA)
PackageTray
TechnologyFLASH - NOR
Memory size64Mbit
Memory formatFLASH
Case24-TBGA
Memory organization8M x 8
Write cycle time - word, page5µs, 3ms

Product details

Obsolete — sourcing path for the S25FL064P0XBHIS30

Buyers filling a BOM line for this 64 Mbit NOR Flash should confirm date code freshness and bake requirements before placing an order.

64 Mbit NOR Flash with SPI Quad I/O at 104 MHz

The S25FL064P0XBHIS30 is a 64 Mbit non-volatile FLASH - NOR memory organized as 8M x 8. Its SPI - Quad I/O interface supports read speeds up to 104 MHz.

24-ball BGA footprint and temperature grade

Housed in a 24-TBGA (6x8 mm body), the S25FL064P0XBHIS30 is surface-mount only. The supplier device package is 24-BGA (6x8).

Frequently asked questions

What is the replacement for S25FL064P0XBHIS30?

No official successor is recorded for the S25FL064P0XBHIS30. Buyers should evaluate functionally similar 64 Mbit SPI Quad I/O NOR Flash parts from the same FL-P family or from competing vendors, verifying pin compatibility and timing parameters against their board layout.

What is the memory interface of S25FL064P0XBHIS30?

The memory interface is SPI - Quad I/O, supporting standard SPI, dual I/O, and quad I/O read commands for higher throughput compared to single-bit SPI.

What package is S25FL064P0XBHIS30?

The S25FL064P0XBHIS30 comes in a 24-TBGA package (24-ball Thin Ball Grid Array), with a supplier device package size of 24-BGA (6x8 mm).