IRF7404TRPBF

Infineon Technologies · HEXFET® Series

Infineon Technologies HEXFET® series, IRF7404TRPBF P-Channel MOSFET, 20V Vdss, 6.7A continuous drain, 40mOhm Rds(on) at 4.5V, 8-SOIC surface-mount package.

IRF7404TRPBF
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[IN STOCK] In Stock: 299 pcs
$2.64/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRF7404TRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeP-Channel
MountingSurface Mount
Drain to source voltage20 V
Drive voltage (Max rds on, min rds on)2.7V, 4.5V
Current - continuous drain (Id) @ 25°C6.7A (Ta)
Power dissipation2.5W (Ta)
Operating temperature-55°C~150°C(TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±12V
TechnologyMOSFET (Metal Oxide)
Case8-SOIC (0.154\", 3.90mm Width)
Vgs(th) (Max) @ id700mV @ 250µA (Min)
Rds on (Max) @ id, vgs40mOhm @ 3.2A, 4.5V
Gate charge (Qg) (Max) @ vgs50 nC @ 4.5 V
Input capacitance (Ciss) (Max) @ vds1500 pF @ 15 V

Technical details

P-channel load switch in an 8-SOIC — the 20V, 6.7A IRF7404TRPBF

The IRF7404TRPBF is a P-Channel MOSFET from Infineon's HEXFET series, rated for a drain-to-source voltage of 20 V and a continuous drain current of 6.7 A at 25°C. It comes in an 8-SOIC surface-mount package, making it a fit for automated assembly on boards where a P-channel device is needed for high-side switching without a charge pump.

Switching performance — the numbers that matter for gate drive and loss budget

The Rds(on) is specified at 40 mOhm maximum at a gate drive of 4.5 V and 3.2 A drain current. That is the on-resistance you design your conduction losses around at the typical logic-level gate voltage. Gate charge Qg is 50 nC at 4.5 V Vgs, and input capacitance Ciss is 1500 pF at 15 V Vds. These set the switching speed and the drive current required from the gate driver — a 50 nC gate at 100 kHz draws 5 mA average from the driver, well within the SOA of a standard logic gate or dedicated driver. The gate threshold voltage is specified as a maximum of 700 mV at 250 µA drain current, with a minimum of 1.0 V implied by the 700 mV max at that low current.

Thermal and environmental limits — operating range and power dissipation

Maximum power dissipation is 2.5 W at 25°C ambient, derated to zero at 150°C junction. In an 8-SOIC with standard copper land area, the thermal resistance RthJA is around 50°C/W — the 2.5 W figure is achievable with good board-level heat sinking.

IRF7404TRPBF
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