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Infineon Technologies IPAN60R650CEXKSA1 — Discrete Semiconductors

Infineon IPAN60R650CEXKSA1 CoolMOS N-Channel MOSFET, 600V

MPNIPAN60R650CEXKSA1
Active

Infineon CoolMOS™ IPAN60R650CEXKSA1, N-Channel Super Junction MOSFET, 600V Vdss, 9.9A Id, 650mOhm Rds(on) at 10V, 20.5nC Qg, PG-TO220-FP, -40°C to 150°C.

$0.8867Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

IPAN60R650CEXKSA1 specifications
ParameterValue
SeriesCoolMOS™
FET typeN-Channel
MountingThrough Hole
Drain to source voltage600 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C9.9A (Tc)
Power dissipation28W (Tc)
Operating temperature-40°C~150°C(TJ)
PackageTube
Vgs±20V
TechnologyMOSFET (Metal Oxide)
FET featureSuper Junction
CaseTO-220-3 Full Pack
Vgs(th) (Max) @ id3.5V @ 200µA
Rds on (Max) @ id, vgs650mOhm @ 2.4A, 10V
Gate charge (Qg) (Max) @ vgs20.5 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds440 pF @ 100 V

Product details

The 600 V Vdss gives a comfortable voltage margin for 230 VAC off-line rectified rails (typically 380 VDC) and for 400 VDC bus architectures. The 28 W maximum power dissipation in the TO-220 Full Pack is roughly half what a standard TO-220 can handle—the plastic full-pack body is the thermal bottleneck, so a heatsink is needed above a few watts of continuous dissipation.

Frequently asked questions

Does IPAN60R650CEXKSA1 require a heat sink?

Yes, for any continuous operation above a few watts of dissipation. The TO-220 Full Pack package has a maximum power rating of 28 W at case temperature, but the plastic body limits heat transfer—a heatsink is needed to keep junction temperature below 150°C under load.