550 MHz QDR II+ SRAM for high-throughput buffer applications
Clock frequency and bus bandwidth — the 550 MHz edge
At 550 MHz, the CY7C2665KV18-550BZXC sustains a data rate of 1.1 G transfers per second per pin on a 36-bit-wide bus. That is roughly 22% higher throughput than the 450 MHz CY7C1650KV18-450BZC, which runs the same 4M x 36 organization at a lower clock. The trade-off is tighter timing closure on the PCB — the 1.8 ns cycle time leaves less margin for trace-length mismatch and requires controlled-impedance routing on all data and address lines.
The 165-ball FBGA (15x17 mm) uses a 1.0 mm ball pitch typical of high-density SRAM packages. The package has no exposed thermal pad — all heat dissipation is through the solder balls and the PCB copper planes. Place at least four 4.7 µF ceramic decoupling capacitors within 5 mm of the ball array on the 1.8 V supply rail to keep the transient response clean at 550 MHz switching.
It is not qualified for industrial or automotive temperature ranges — if the design sees -40°C or +85°C, look at the industrial-grade variants in the same family.