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Infineon Technologies CY7C25682KV18-550BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C25682KV18-550BZXC Infineon 72Mbit SRAM, 550 MHz

MPNCY7C25682KV18-550BZXC
End of Life

Infineon CY7C25682KV18-550BZXC synchronous SRAM, DDR II+, 72Mbit, 4M x 18 organization, 550 MHz clock, 1.7V-1.9V supply, 165-FBGA (13x15), tray.

$355.5400Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C25682KV18-550BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency550 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II+
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization4M x 18

Product details

72 Mbit DDR II+ SRAM at 550 MHz

The CY7C25682KV18-550BZXC is a 72 Mbit synchronous SRAM from Infineon, organized as 4M x 18 bits and built on DDR II+ technology. The 550 MHz clock rate means the memory delivers double-data-rate transfers on both edges of the clock, effectively doubling the data throughput per pin compared to a single-data-rate part at the same frequency.

Operates from a single 1.7 V to 1.9 V supply rail — a narrow window that keeps the I/O levels compatible with low-voltage ASICs and FPGAs without needing a separate VDDQ rail.

The parallel memory interface routes 18 data lines plus address and control; the 550 MHz edge rate demands careful signal-integrity layout with matched trace lengths and proper termination on the data strobes.

Frequently asked questions

What is the memory organization and interface of this SRAM?

Organized as 4M x 18 bits (72 Mbit total) with a parallel interface. The DDR II+ architecture transfers data on both clock edges at 550 MHz, giving a peak data rate of 1.1 G transfers per second per pin.

What package does CY7C25682KV18-550BZXC use and how is it supplied?

This is standard for BGA memory devices; the tray format is typical for volume assembly where the parts are picked and placed directly from the tray.