Infineon CY7C2270XV18-600BZXC, 36Mbit synchronous DDR II+ SRAM, 600 MHz clock, parallel interface, 1.7–1.9V supply, 165-FBGA (13×15 mm) tray, 0°C to 70°C commercial temp.
| Parameter | Value |
|---|---|
| Memory type | Volatile |
| Mounting type | Surface Mount |
| Voltage | 1.7V ~ 1.9V |
| Frequency | 600 MHz |
| Memory interface | Parallel |
| Operating temperature | 0°C ~ 70°C (TA) |
| Package | Tray |
| Technology | SRAM - Synchronous, DDR II+ |
| Memory size | 36Mbit |
| Memory format | SRAM |
| Case | 165-LBGA |
| Memory organization | 1M x 36 |
The Infineon CY7C2270XV18-600BZXC is a 36 Mbit synchronous DDR II+ SRAM organized as 1M x 36, clocked at 600 MHz over a parallel interface. The 1.7 V to 1.9 V supply rail is tight — the board's regulator needs to hold that tolerance. Commercial temperature range (0°C to 70°C) means it belongs in an indoor, climate-controlled rack.
This part is sourced to order through independent distribution. Availability and current pricing are confirmed at quote time against an RFQ — no stock or price figures are published here.
The CY7C1265XV18-633BZXC (633 MHz, same 36 Mbit, 1M x 36, same package and supply) is a functional alternative, though it is a higher speed bin and may also carry EOL risk. The CY7C2265KV18-450BZC (450 MHz) is a slower drop-in for the same footprint.
Yes — same 165-FBGA (13x15 mm) package, same ball map, same supply voltage. The board footprint is identical. The only change needed is adjusting the clock frequency in the memory controller from 450 MHz to 600 MHz.