Skip to main content
Infineon Technologies CY7C2265XV18-600BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C2265XV18-600BZXC QDR II+ SRAM, 36Mbit, 600 MHz

MPNCY7C2265XV18-600BZXC
Active

Cypress CY7C2265XV18-600BZXC, QDR II+ Synchronous SRAM, 36Mbit (1M x 36), 600 MHz clock, Parallel interface, 1.7V-1.9V supply, 165-FBGA (13x15 mm), 0°C to 70°C, Tray.

$95.9750Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C2265XV18-600BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency600 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II+
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 36

Product details

QDR II+ SRAM at 600 MHz — what it delivers

The Cypress CY7C2265XV18-600BZXC is a 36 Mbit QDR II+ synchronous SRAM organized as 1M x 36, clocked at 600 MHz. QDR II+ architecture gives separate read and write data ports, so back-to-back reads and writes incur no bus-turnaround dead cycles — the bus stays full every clock edge.

That low voltage keeps dynamic power in check at 600 MHz, but it also means the regulator needs tight tolerance and low noise — a standard 1.8 V LDO with 1% accuracy is fine, but a noisy switching supply without post-filtering can eat into timing margin. No industrial or automotive variants on this specific order code.

Package and board-level considerations

Housed in a 165-ball FBGA measuring 13 x 15 mm. It is a surface-mount BGA.

Frequently asked questions

What package type does CY7C2265XV18-600BZXC use?

It comes in a 165-ball FBGA (13 x 15 mm body), surface-mount package.