400 MHz QDR II+ SRAM in a 165-FBGA
It clocks at 400 MHz with a parallel interface, running from a 1.7V to 1.9V supply. The 165-FBGA (13x15 mm) package is surface-mount and suited for high-speed buffer and cache applications in networking, telecom, and industrial equipment that demand sustained read/write throughput without bus-turnaround dead cycles.
At 400 MHz the QDR II+ interface delivers back-to-back read and write operations on separate data ports, eliminating the dead cycle that conventional SRAMs incur when switching directions. For a system that needs to sustain full-rate data streaming — packet buffers, lookup tables, or real-time signal processing — this clock rate directly sets the bandwidth ceiling. The 1M x 36 organization gives a 36-bit word width, matching common processor or FPGA bus widths without external muxing.
Industrial temperature range — where it runs
The 1.7V to 1.9V core supply aligns with low-voltage 1.8V-logic families, keeping I/O levels compatible without extra level shifters.
Last-time-buy — plan the BOM now
The CY7C2265KV18-400BZXI carries a Last Buy status. That means the manufacturer has announced final orders; once the window closes, new supply will only come from surplus or broker channels. If this part is on your BOM, secure your lifetime buy or identify a drop-in replacement before the LTB cutoff.
165-FBGA — rework considerations
The 165-ball FBGA (13x15 mm) is a fine-pitch BGA. Rework requires a preheat profile that keeps the board below 150°C while the ball grid reflows. The package has no exposed thermal pad, so heat transfer is through the balls alone — good stencil design and a proper bake (MSL unknown, but assume MSL 3 unless marked) are essential to avoid head-in-pillow defects.