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Infineon Technologies CY7C1625KV18-333BZXC — Memory (DRAM / SRAM / Flash / EEPROM)
Infineon Technologies

Cypress CY7C1625KV18-333BZXC QDR II SRAM, 144 Mbit, 333 MHz

MPNCY7C1625KV18-333BZXC
End of Life

Cypress (Infineon) CY7C1625KV18-333BZXC, QDR II synchronous SRAM, 144 Mbit, 333 MHz clock, 16M×9 organization, 1.7–1.9 V supply, parallel interface, 165-FBGA (15×17 mm) tray, commercial temperature 0°C–70°C.

$309.3500Ref. price · indicative, final on quote
CY7C1625KV18-333BZXC datasheet
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

CY7C1625KV18-333BZXC Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency333 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size144Mbit
Memory formatSRAM
Case165-LBGA
Memory organization16M x 9

Product details

QDR II SRAM at 333 MHz — what the bus needs

The CY7C1625KV18-333BZXC is a Cypress (now Infineon) QDR II synchronous SRAM organized as 16M×9, clocked at 333 MHz, with a 1.7–1.9 V supply.

144 Mbit density — where it fits in the BOM

At 144 Mbit, this part is organized as 16M×9.

Commercial temperature — deployment limits

Rated for 0°C to 70°C, this part is intended for indoor, temperature-controlled environments: telecom central offices, data-center line cards, and benchtop test gear. It is not specified for industrial cabinets, outdoor enclosures, or automotive under-hood applications without active cooling that keeps the junction temperature within the commercial range.

Frequently asked questions

Will CY7C1625KV18-333BZXC drop into a board designed for CY7C1613KV18-333BZXC?

Both parts share the same 333 MHz clock, 144 Mbit density, 1.7–1.9 V supply, and 165-FBGA package, but the CY7C1625KV18-333BZXC is organized as 16M×9 while the CY7C1613KV18-333BZXC is 8M×18. The bus width differs — a board wired for an 18-bit data bus would need a layout change to use the 9-bit part.