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Infineon Technologies CY7C1570KV18-550BZXI — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1570KV18-550BZXI 72Mbit DDR II+ SRAM, 550 MHz, 165-LBGA

MPNCY7C1570KV18-550BZXI
Last Buy

Infineon/Cypress CY7C1570KV18-550BZXI, 72Mbit Synchronous SRAM - DDR II+, 550 MHz clock, 2M x 36 organization, 1.7V-1.9V supply, -40°C to 85°C, 165-LBGA (13x15 FBGA), Tray.

$284.8750Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1570KV18-550BZXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency550 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II+
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

The Infineon (formerly Cypress) CY7C1570KV18-550BZXI is a 72Mbit synchronous SRAM using DDR II+ (Double Data Rate II+) architecture, organized as 2M words by 36 bits. It clocks at 550 MHz, delivering back-to-back read/write throughput without dead cycles between transactions — the DDR II+ bus-turnaround advantage over standard synchronous SRAM. The 36-bit wide word suits networking line cards, telecom switch fabrics, and high-end test equipment where a wide data path matches the ASIC or FPGA bus natively. The part comes in a 165-ball fine-pitch BGA (13x15 mm FBGA package).

At 550 MHz, the DDR II+ interface transfers data on both clock edges, so the effective data rate is 1.1 G transfers per second per pin. With a 36-bit bus, that is roughly 39.6 Gbit/s aggregate bandwidth. The synchronous pipeline means the SRAM can sustain back-to-back reads or writes without inserting idle cycles, critical for high-utilization buffer applications like packet processing. The 550 MHz rating is the maximum clock; the part also supports lower frequencies for power-sensitive modes.

Last Buy lifecycle — sourcing reality

Buyers filling a BOM line for an existing production run should secure final-order quantities through the LTB window. After that, availability shifts to the surplus and broker channel.

The 165-ball LBGA (13x15 mm FBGA) is a fine-pitch BGA — standard for high-density memory devices. Surface-mount assembly; MSL level should be verified from the latest Cypress handling note.

Frequently asked questions

Is CY7C1570KV18-550BZXI still available for purchase?

Yes, it is available through the independent channel, but it is in Last Buy status. Buyers should secure quantities for existing BOM lines promptly, as the manufacturer last-time-buy window may close.

What is the recommended replacement for CY7C1570KV18-550BZXI?

A parametric search across the 72Mbit DDR II+ SRAM family at the same 165-FBGA package and 1.7V-1.9V supply range is the practical starting point for a replacement evaluation.

Is CY7C1570KV18-550BZXI RoHS compliant?

The part number does not carry an explicit RoHS indicator in the order code, but the BZXI suffix typically denotes a lead-free, RoHS-compliant finish per Cypress/Infineon convention. Verify the latest Cypress RoHS declaration for the specific date code.