Its 450 MHz clock rate delivers back-to-back read/write throughput without dead cycles, which is the primary reason this part was selected for high-bandwidth FPGA and ASIC memory interfaces in networking and telecom line cards.
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165-ball FBGA — footprint and rework considerations
The 165-ball FBGA (13x15 mm body) uses a 1.0 mm ball pitch typical of high-density SRAM packages. The supplier device package is 165-FBGA (13x15). For rework, a pre-bake at 125°C for 24 hours is standard if the floor-life window has been exceeded.
