The Cypress CY7C1521KV18-250BZXC is a 72Mbit synchronous DDR II SRAM organized as 2M x 36, clocked at 250 MHz and operating from a 1.7V to 1.9V core supply. It uses a parallel memory interface and comes in a 165-ball FBGA (13x15 mm) package for surface-mount assembly. This is a volatile, high-bandwidth memory part built for applications that need fast, back-to-back read/write throughput — think network packet buffers, telecom line cards, or test equipment waveform storage where the bus can run at full DDR rate without dead cycles.
At 250 MHz in DDR II mode, data is transferred on both clock edges, giving an effective 500 MT/s data rate on a 36-bit-wide bus. That translates to about 18 Gbit/s raw bandwidth. The 1.7V–1.9V supply range means the I/O levels are HSTL-class, not LVTTL — the bus termination and reference voltage (Vref) need to be designed for that, not assumed. If your existing board runs 1.8V HSTL, this part drops in; if you are migrating from a 3.3V SRAM, the signal levels require a re-spin of the interface.
It belongs in a controlled indoor environment — office networking gear, lab instruments, or server-class equipment. Not for outdoor telecom cabinets, engine bays, or unheated enclosures. If your bill of materials calls for the industrial-temperature variant, the suffix changes to 'I' (CY7C1521KV18-250BZXI), which is a different order code and may carry a different lifecycle status.
The product status for CY7C1521KV18-250BZXC is marked Obsolete. Cypress (now part of Infineon) has discontinued this exact order code. For a production BOM that still needs this part, the procurement path is through independent distribution — last-time-buy inventory or surplus stock.
Package and footprint — 165-LBGA
Supplied in a 165-ball LBGA (13x15 mm body) on tray. The ball pitch is 1.0 mm — a standard BGA footprint that routes out on a 4-layer board with via-in-pad if the design is dense. No exposed thermal pad; the package dissipates through the balls and the PCB copper.