Cypress CY7C1520KV18-250BZI, 72Mbit Synchronous DDR II SRAM, 2M x 36, 250 MHz clock, Parallel interface, 1.7V–1.9V supply, -40°C to 85°C, 165-FBGA (13x15), Tray.
| Parameter | Value |
|---|---|
| Memory type | Volatile |
| Mounting | Surface Mount |
| Supply voltage | 1.7V ~ 1.9V |
| Clock frequency | 250 MHz |
| Memory interface | Parallel |
| Operating temperature | -40°C ~ 85°C (TA) |
| Package | Tray |
| Technology | SRAM - Synchronous, DDR II |
| Memory size | 72Mbit |
| Memory format | SRAM |
| Case | 165-LBGA |
| Memory organization | 2M x 36 |
The lifecycle stage is listed as current, which is contradictory — the official record marks it discontinued.
The 250 MHz clock drives double-data-rate transfers on each edge across the 36-bit bus.
Housed in a 165-ball FBGA measuring 13x15 mm, surface-mount only. The fine-pitch BGA requires controlled reflow profiling and X-ray inspection for voiding under the balls.
Buyers need a pin-for-pin compatible part to avoid redesigning their board.
Knowing lifecycle status determines whether to source remaining stock or find a replacement.
BOM fillers need immediate availability to avoid production delays.
Design engineers must verify pin compatibility before layout or substitution.
Sourcing buyers compare inventory levels across channels for best price and lead time.
If the part is unavailable, engineers need verified cross references to continue production.