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Infineon Technologies CY7C1515KV18-333BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1515KV18-333BZXC 72Mbit QDR II SRAM, 333 MHz

MPNCY7C1515KV18-333BZXC
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Cypress CY7C1515KV18-333BZXC, QDR II synchronous SRAM, 72Mbit, 2M x 36 organization, 333 MHz clock frequency, parallel interface, 1.7V–1.9V supply, 0°C to 70°C, 165-ball FBGA (13x15 mm), Tray.

$190.9250Ref. price · indicative, final on quote
Infineon Technologies CY7C1515KV18-333BZXC datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1515KV18-333BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency333 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

72 Mbit QDR II SRAM at 333 MHz — what the clock rate buys you

The 333 MHz clock frequency delivers four data words per clock cycle. Organised as 2M x 36, the 36-bit word width maps cleanly to a 32-bit data bus with four parity or ECC check bits, saving the board from an external parity RAM or a wider-than-necessary memory bus.

165-ball FBGA — the PCB layout reality

The ball map is not symmetrical, so the fanout via pattern and decoupling capacitor placement need to be worked out before the board is laid out. For a telecom central-office or data-centre switch where ambient is controlled, this is fine. For an outdoor base-station cabinet or a factory-floor controller, it is not the right choice.

Frequently asked questions

What is the memory organisation of CY7C1515KV18-333BZXC?

The memory is organised as 2M words by 36 bits, giving a total density of 72 Mbit. The 36-bit word width accommodates a 32-bit data bus plus four bits for parity or ECC without needing an external memory.

What package does CY7C1515KV18-333BZXC use?

It comes in a 165-ball FBGA (fine-pitch ball grid array) with a 13x15 mm body, designated as 165-FBGA (13x15) in the supplier device package field. The shipping medium is Tray.