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Infineon Technologies CY7C1513KV18-250BZC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1513KV18-250BZC QDR II SRAM, 72Mbit, 250 MHz

MPNCY7C1513KV18-250BZC
Last Buy

Infineon CY7C1513KV18-250BZC, 72Mbit synchronous QDR II SRAM, 250 MHz clock frequency, 4M x 18 organization, 1.7–1.9V supply, 165-LBGA, commercial 0–70°C, tray.

$117.9375Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1513KV18-250BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency250 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization4M x 18

Product details

72 Mbit QDR II SRAM at 250 MHz — what it does

It clocks at 250 MHz with a 4M x 18 organization, giving the bus two independent read and write ports that eliminate dead cycles on back-to-back transactions. This part is designed for high-throughput buffer applications — typically network switch fabric packet memory, line-card buffers, and cache in telecom infrastructure where every nanosecond of bus turnaround matters.

250 MHz — what that clock buys you

At 250 MHz the QDR II interface delivers a peak data rate of 1 GB/s per port (double-data-rate on both read and write ports). That sustained throughput is what drives the choice for 40G/100G line-rate packet processing. The 1.7V to 1.9V core supply keeps I/O swing tight, reducing simultaneous-switching noise on a wide bus.

Last Buy — plan the LTB window now

Infineon lists the CY7C1513KV18-250BZC in Last Buy status. That means the final order window is open — once it closes, the part moves to end-of-life and only surplus or broker inventory remains. If this SRAM is in a production design, lock the last-time-buy quantities and qualify a second-source or migration path before the window shuts.

Package and temperature — board-fit constraints

Supplied in a 165-ball LBGA (13x15 mm body, 1.0 mm pitch). That's a fine-pitch BGA — needs controlled impedance on the QDR bus, matched trace lengths, and a full via array under the package for thermal relief. Not rated for outdoor base stations or engine-bay electronics; this is indoor rack-mount equipment territory.

Frequently asked questions

Is CY7C1513KV18-250BZC obsolete?

Infineon has placed this part in Last Buy status. It is not yet discontinued, but the final purchasing window is active. Once the LTB period ends, the part will be obsolete and only available through surplus or independent channels. Plan your last order now.

What is the operating temperature of CY7C1513KV18-250BZC?

Not suitable for extended-temperature or outdoor environments without additional thermal management.

Is CY7C1513KV18-250BZC compatible with CY7C1513KV18-250BZX?

The 'BZC' and 'BZX' suffixes typically differ in packing or lead-free finish. The BZC variant is tray-packed; the BZX variant may be tape-and-reel or a different RoHS compliance level. Electrical specifications are identical, but verify the exact suffix against your assembly line's requirements before substituting.