Infineon (Cypress) CY7C1512KV18-333BZXC, QDR II synchronous SRAM, 72Mbit (4M x 18), 333 MHz clock, parallel interface, 1.7V–1.9V supply, 165-FBGA (13x15 mm), commercial temperature 0°C to 70°C, tray.
| Parameter | Value |
|---|---|
| Memory type | Volatile |
| Mounting | Surface Mount |
| Supply voltage | 1.7V ~ 1.9V |
| Clock frequency | 333 MHz |
| Memory interface | Parallel |
| Operating temperature | 0°C ~ 70°C (TA) |
| Package | Tray |
| Technology | SRAM - Synchronous, QDR II |
| Memory size | 72Mbit |
| Memory format | SRAM |
| Case | 165-LBGA |
| Memory organization | 4M x 18 |
The tray shipping medium is standard for prototype and low-to-medium volume builds; tape-and-reel variants exist under different ordering suffixes if automated pick-and-place volume is planned.
Listed as Active in the manufacturer's lifecycle, so there is no imminent end-of-life or last-time-buy pressure.
Buyers need to know lifecycle status to avoid design-in risk or find alternatives if end-of-life.
Sourcing buyers require real-time price and availability to fill BOM lines and manage procurement.
Design engineers validate voltage compatibility with system power rails before selection.
Mechanical and PCB layout engineers need package dimensions and pinout for design integration.
When part is unavailable or obsolete, buyers need drop-in or functional alternatives to avoid redesign.
Transactional buyers want reliable distributors with short lead times to maintain production schedules.