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Infineon Technologies CY7C1512KV18-300BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1512KV18-300BZXC QDR II SRAM, 72 Mbit, 300 MHz

MPNCY7C1512KV18-300BZXC
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Infineon Technologies CY7C1512KV18-300BZXC QDR II SRAM, 72 Mbit (4M x 18), 300 MHz clock, 1.7V–1.9V supply, 165-FBGA (13x15 mm), tray.

$180.1100Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1512KV18-300BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage1.7V ~ 1.9V
Clock frequency300 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization4M x 18

Product details

72 Mbit QDR II at 300 MHz — the throughput anchor

The CY7C1512KV18-300BZXC is a 72 Mbit Quad Data Rate (QDR) II synchronous SRAM organized as 4M x 18 bits. The 300 MHz clock rate delivers four data transfers per cycle — two on each clock edge — for a peak read bandwidth of 2.7 Gbytes/s on the 18-bit bus. QDR II architecture separates read and write data ports, eliminating bus-turnaround dead cycles that plague common-I/O SRAMs. The parallel memory interface keeps the data path deterministic for pipelined logic.

Operates from a 1.7V to 1.9V core supply — the 1.8V nominal rail is standard for this density class. The 165-FBGA package (13x15 mm body) uses a 1.0 mm ball pitch. The layout engineer should budget four inner signal layers for fan-out; the core supply decoupling caps sit directly under the BGA on the opposite side of the board.

Board integration and delivery

Supplied in tray format — the standard carrier for BGA devices in volume assembly. The 165-ball FBGA footprint is JEDEC-registered; the solder-ball composition is RoHS-compatible per Infineon's standard material declaration.

Frequently asked questions

What is the memory organization and interface of this SRAM?

The CY7C1512KV18-300BZXC is organized as 4M x 18 bits (72 Mbit total) with a parallel QDR II interface. The 300 MHz clock rate enables four data transfers per cycle on the 18-bit data bus.

What package does the CY7C1512KV18-300BZXC use?

It comes in a 165-ball FBGA package (13x15 mm body, 1.0 mm ball pitch), supplied in tray format for surface-mount assembly.