It clocks at 167 MHz and uses a parallel memory interface, delivering back-to-back read and write transactions without dead cycles — the defining benefit of the QDR II family for high-throughput buffer applications. It comes in a 165-ball FBGA (15x17 mm) package for surface-mount assembly.
The product status is Obsolete.
The 165-ball FBGA (15x17 mm) package is a fine-pitch BGA requiring controlled reflow profiling and X-ray inspection for solder-joint integrity.
