The CY7C1480BV33-167BZXC: Housed in a 165-ball FBGA (15x17 mm), this is a fine-pitch BGA that demands careful reflow profiling. The 0.80 mm ball pitch is manageable with a standard stencil, but the 165-ball array means the centre balls are hard to inspect post-reflow — X-ray is the only reliable check for solder joint integrity under the die shadow. The package ships in trays, not tape-and-reel, so it is suited for low-to-medium volume assembly or hand placement. Surface-mount only; no through-hole variant.
Temperature grade and supply tolerance
The supply range of 3.135 V to 3.6 V gives about ±7 % margin around a nominal 3.3 V rail; a clean 3.3 V supply with <5 % ripple keeps the part in spec without extra regulation.