Skip to main content
Infineon Technologies CY7C1480BV25-200BZC — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1480BV25-200BZC 72Mbit SRAM, 200 MHz, 3 ns

MPNCY7C1480BV25-200BZC
Active

Cypress CY7C1480BV25-200BZC, synchronous SDR SRAM, 72Mbit (2M x 36), 200 MHz clock, 3 ns access time, parallel interface, 2.375V–2.625V supply, 165-FBGA (15x17 mm), 0°C to 70°C.

$131.4000Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1480BV25-200BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage2.375V ~ 2.625V
Clock frequency200 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time3 ns
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

The Cypress CY7C1480BV25-200BZC is a 72 Mbit synchronous SRAM organized 2M x 36, clocked at 200 MHz with a 3 ns access time. It is a single-data-rate (SDR) part with a 2.375 V to 2.625 V supply and 165-ball FBGA (15x17 mm) footprint.

200 MHz clock and 3 ns access — what that means on the bench

A 200 MHz clock with a 3 ns access time yields a 200 MT/s data rate on a 36-bit bus. The 2M x 36 organization provides 36 bits per access.

Package and temperature — board-fit constraints

The 165-ball FBGA (15x17 mm) is a fine-pitch BGA — expect micro-vias or blind vias for fanout on a multi-layer board. No industrial or automotive derating here; if the board sees an unheated cabinet or engine bay, this isn't the SRAM for that slot.

Frequently asked questions

What is the package for CY7C1480BV25-200BZC?

The package is a 165-ball FBGA (15x17 mm), surface-mount, supplied in a tray.

What is the memory technology and organization?

It is a synchronous SDR SRAM, volatile, organized 2M x 36 (72 Mbit total), with a parallel interface.