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Infineon Technologies CY7C1474V25-200BGI — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1474V25-200BGI Infineon 72Mbit SRAM, 200 MHz, Last Buy

MPNCY7C1474V25-200BGI
Last Buy

Infineon Technologies NoBL™ SRAM, CY7C1474V25-200BGI, 72Mbit Synchronous SDR, 200 MHz clock, 3 ns access, 1M x 72 organization, 2.5V supply, -40 to 85°C, 209-FBGA tray.

$177.9600Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1474V25-200BGI specifications
ParameterValue
SeriesNoBL™
Memory typeVolatile
MountingSurface Mount
Supply voltage2.375V ~ 2.625V
Clock frequency200 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time3 ns
Memory size72Mbit
Memory formatSRAM
Case209-BGA
Memory organization1M x 72

Product details

72 Mbit synchronous SRAM for high-throughput data planes

The CY7C1474V25-200BGI is a 72 Mbit synchronous SRAM from the NoBL (No Bus Latency) family, organized as 1M x 72 and clocked at 200 MHz. The 3 ns access time means the first read word appears on the bus within three clock edges after the address is presented — critical for zero-wait-state cache or packet-buffer lookups where every cycle counts. The 72-bit wide data bus maps naturally to 64-bit data paths with parity or ECC bits, so a single chip serves the full memory width of a network processor or FPGA without ganging multiple narrower parts.

Last Buy — what it means for procurement

Infineon has classified this part as Last Buy — the final production window is open, and once the inventory is exhausted the manufacturer will not replenish. This is the trigger to secure lifetime-buy quantities or qualify a replacement before the allocation dries up.

Industrial temperature grade and 2.5 V supply rail

The supply tolerance is tight — 2.375 V to 2.625 V — so the 2.5 V rail must stay within ±2.5 % including ripple; a standard 2.5 V LDO with 1 % accuracy covers this comfortably. The 209-ball FBGA package (14 x 22 mm body) uses a 1.0 mm ball pitch. Page 7 of the datasheet (the mechanical drawing) shows the ball map — the outer two rows are mostly VDDQ and VSS, which simplifies fan-out on a 6-layer PCB; the core signals sit in the inner rows.

NoBL architecture — why it matters for throughput

The NoBL (No Bus Latency) pipeline eliminates the dead cycle between consecutive read and write operations that plagues standard synchronous SRAMs. On a back-to-back read-after-write sequence, the data appears on the bus without inserting an idle clock — this lifts sustained throughput to near the clock rate for mixed-transaction traffic. The parallel memory interface (address, data, control) is JEDEC-compatible with other 1M x 72 pipelined SRAMs, so the PCB layout and FPGA controller logic can be designed to accept multiple second-source candidates from the same socket.