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Infineon Technologies CY7C1474BV25-167BGI — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1474BV25-167BGI Infineon NoBL SRAM, 72Mbit, 167 MHz

MPNCY7C1474BV25-167BGI
Obsolete

Infineon CY7C1474BV25-167BGI, NoBL™ Synchronous SRAM, 72Mbit (1M x 72), 167 MHz clock, 3.4 ns access time, 2.375V–2.625V supply, -40°C to 85°C, 209-FBGA (14x22 mm), Tray.

$127.9900Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1474BV25-167BGI specifications
ParameterValue
SeriesNoBL™
Memory typeVolatile
MountingSurface Mount
Supply voltage2.375V ~ 2.625V
Clock frequency167 MHz
Memory interfaceParallel
Operating temperature-40°C~85°C(TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time3.4 ns
Memory size72Mbit
Memory formatSRAM
Case209-BGA
Memory organization1M x 72

Product details

The NoBL architecture eliminates the dead bus cycle between read and write operations, allowing back-to-back transactions at the full 167 MHz clock rate with a 3.4 ns access time.

At 167 MHz the cycle time is 6 ns. The 3.4 ns access time leaves roughly 2.6 ns of setup-and-hold budget for the FPGA or ASIC on the other side of the bus — enough for most 2.5 V interfaces without external PLL retiming, but tight enough that trace-length matching on the 72-bit data path matters. This part was designed into systems that cannot tolerate the dead cycle of a standard pipelined SRAM; the NoBL flow-through lets the controller issue a read on one clock edge and a write on the next without an idle cycle.

No direct successor order code is provided in the lifecycle record. If a form-fit-function replacement is needed, Infineon's broader NoBL and synchronous SRAM portfolio includes pin-compatible density and speed grades, but the exact 1M x 72 organization at 167 MHz in a 209-FBGA should be validated against the current product selector.

209-ball FBGA — footprint and handling

The 1.0 mm ball pitch is standard for this density, but the 14x22 mm body is longer than the more common 13x18 mm 209-ball footprint — verify the PCB land pattern against the supplier device package drawing. The Tray shipping medium means the parts are not on tape; plan for pick-and-place with a tray feeder or transfer to tape at the CM.

Frequently asked questions

What is a direct replacement for CY7C1474BV25-167BGI?

Infineon's NoBL and synchronous SRAM portfolio includes pin-compatible density and speed options, but the exact 1M x 72 organization at 167 MHz in a 209-FBGA should be cross-referenced against the current product selector for a form-fit-function match.