Infineon NoBL™ series CY7C1470V33-167BZC, 72 Mbit synchronous SRAM, 167 MHz clock, 3.4 ns access time, 2M x 36 organization, 3.135–3.6 V supply, 165-LBGA package, 0–70 °C.
| Parameter | Value |
|---|---|
| Series | NoBL™ |
| Memory type | Volatile |
| Mounting | Surface Mount |
| Supply voltage | 3.135V ~ 3.6V |
| Clock frequency | 167 MHz |
| Memory interface | Parallel |
| Operating temperature | 0°C ~ 70°C (TA) |
| Package | Tray |
| Technology | SRAM - Synchronous, SDR |
| Access time | 3.4 ns |
| Memory size | 72Mbit |
| Memory format | SRAM |
| Case | 165-LBGA |
| Memory organization | 2M x 36 |
The Infineon CY7C1470V33-167BZC is a 72 Mbit synchronous SRAM organized as 2M x 36, clocked at 167 MHz with a 3.4 ns access time. The NoBL™ architecture eliminates dead cycles between read and write turns, sustaining full pipeline throughput on a shared address bus.
The commercial temperature grade restricts this SRAM to equipment that lives in an air-conditioned room: server racks, central-office telecom, lab instruments.
Yes, the CY7C1470V33-167BZC is end-of-life (EOL hot). Factory production has ceased; the part is available through the surplus and independent distribution channel. Sourced to order against an RFQ.
The CY7C1470V33-167BZC uses a 165-ball LBGA (15x17 mm) footprint. The pinout is defined by the standard 165-FBGA ball map for the CY7C1470 family; the supplier device package is 165-FBGA (15x17).
No official direct replacement has been announced. The CY7C1470V33-200BZC (200 MHz speed grade) shares the same 165-LBGA footprint and 2M x 36 organization; verify timing closure at 200 MHz before substituting.
Operating temperature is 0°C to 70°C (commercial grade). Supply voltage range is 3.135 V to 3.6 V.
The suffix difference (BZC vs BZXC) typically indicates a packaging or material-set variant. Pinout and footprint are identical (165-LBGA), but verify the specific datasheet revision for any electrical or timing differences before drop-in substitution.