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Infineon Technologies CY7C1470BV33-200BZCT — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1470BV33-200BZCT 72Mbit NoBL SRAM, 200 MHz, 3 ns

MPNCY7C1470BV33-200BZCT
Obsolete

Cypress CY7C1470BV33-200BZCT, NoBL™ series, 72Mbit Synchronous SDR SRAM, 2M x 36 organization, 200 MHz clock frequency, 3 ns access time, 3.135V~3.6V supply, 165-LBGA (15x17 mm), 0°C~70°C operating temperature.

$127.9900Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1470BV33-200BZCT specifications
ParameterValue
SeriesNoBL™
Memory typeVolatile
MountingSurface Mount
Supply voltage3.135V ~ 3.6V
Clock frequency200 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTape & Reel (TR)
TechnologySRAM - Synchronous, SDR
Access time3 ns
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

The CY7C1470BV33-200BZCT: The NoBL architecture eliminates the dead bus cycles typical of pipelined SRAMs during read-to-write or write-to-read transitions, sustaining full back-to-back throughput at the rated clock rate. It is designed for high-bandwidth cache buffers, network packet memory, and DSP scratchpad applications where deterministic latency and continuous data flow are required.

200 MHz clock and 3 ns access — what the timing means for the bus

The 200 MHz clock frequency and 3 ns access time are the headline timing specs. At 200 MHz, the cycle time is 5 ns, and the 3 ns access time leaves a 2 ns window for address-to-data valid plus hold — tight but workable with a well-terminated PCB layout. The NoBL pipeline means the part can accept a new read or write address every clock cycle without inserting idle cycles for bus turnaround, which is the key advantage over standard synchronous SRAMs. For a design already using a 3.3 V SRAM bus at 133 MHz or 166 MHz, this part offers a direct speed upgrade path without changing the supply rail or memory organization.

Obsolete — lifecycle reality and sourcing path

The CY7C1470BV33-200BZCT is officially marked as Obsolete by Cypress (now Infineon).

The ball pitch and layout follow the standard Cypress 165-ball FBGA footprint for this density tier. For PCB layout, confirm the ball-out against the datasheet — the 2M x 36 organization maps to 36 data lines plus address, control, and clock signals.

Frequently asked questions

Is CY7C1470BV33-200BZCT obsolete?

Yes, the official lifecycle status is Obsolete. Sourcing is limited to the surplus and broker market.

What is the replacement for CY7C1470BV33-200BZCT?

No official replacement order code is recorded. A functionally equivalent part in the same NoBL family may exist, but any substitution must be validated for pin compatibility, timing, and footprint against your specific PCB layout.

What is the footprint of CY7C1470BV33-200BZCT?

The package is a 165-ball FBGA with a 15 x 17 mm body. The ball pitch and layout follow the standard Cypress 165-ball FBGA footprint for this memory density. Confirm the ball-out against the datasheet before committing the PCB.