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Infineon Technologies CY7C1470BV33-200AXC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1470BV33-200AXC Cypress NoBL™ SRAM, 72Mbit, 200 MHz

MPNCY7C1470BV33-200AXC
End of Life

Cypress NoBL™ CY7C1470BV33-200AXC, Synchronous SRAM, 72Mbit (2M x 36), 200 MHz clock, 3 ns access time, 3.135V–3.6V supply, 100-LQFP surface-mount, 0°C to 70°C commercial temperature.

$152.5500Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

CY7C1470BV33-200AXC Technical Specifications
ParameterValue
SeriesNoBL™
Memory typeVolatile
Mounting typeSurface Mount
Voltage3.135V ~ 3.6V
Frequency200 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time3 ns
Memory size72Mbit
Memory formatSRAM
Case100-LQFP
Memory organization2M x 36

Product details

200 MHz synchronous SRAM for high-throughput data buffers

The CY7C1470BV33-200AXC is a 72 Mbit synchronous SRAM organized as 2M x 36, clocked at 200 MHz with a 3 ns access time. It belongs to the NoBL™ series, which eliminates dead cycles between read and write operations on the same port.

Lifecycle and sourcing posture

The CY7C1470BV33-200AXC carries an Active lifecycle status from Cypress (now Infineon), meaning the manufacturer continues to produce and support the part for new designs and ongoing production. No end-of-life notice or last-time-buy schedule is available.

Frequently asked questions

What is the closest functional second-source for CY7C1470BV33-200AXC?

The CY7C1470V25-200BZI is a pin-compatible alternative within the same NoBL™ family, offering the same 72 Mbit density and 200 MHz clock but at a 2.5 V supply with an industrial temperature range (-40°C to 85°C) in a 100-FBGA package. Verify the package footprint before substituting.