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Infineon Technologies CY7C1460KVE33-167AXI — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1460KVE33-167AXI NoBL SRAM, 36Mbit, 167 MHz

MPNCY7C1460KVE33-167AXI
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Infineon CY7C1460KVE33-167AXI, NoBL™ series, 36Mbit synchronous SRAM, 167 MHz clock, 3.4 ns access, 1M x 36 organization, 3.135-3.6 V supply, -40 to 85°C, 100-LQFP tray.

$54.0889Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1460KVE33-167AXI specifications
ParameterValue
SeriesNoBL™
Memory typeVolatile
MountingSurface Mount
Supply voltage3.135V ~ 3.6V
Clock frequency167 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time3.4 ns
Memory size36Mbit
Memory formatSRAM
Case100-LQFP
Memory organization1M x 36

Product details

36Mbit NoBL synchronous SRAM for high-throughput data buffering

The Infineon CY7C1460KVE33-167AXI is a 36Mbit synchronous SRAM from the NoBL™ family, organized as 1M x 36 and clocked at 167 MHz with a 3.4 ns access time. It uses a parallel memory interface and operates from a 3.135V to 3.6V supply. This is a pipelined, single-data-rate (SDR) SRAM — every clock edge presents a new address, and the registered outputs follow on the next rising edge. The NoBL architecture eliminates the dead bus cycle between read and write turns, so back-to-back transactions run at full clock rate without idle cycles. Typical deployment targets are network switch buffers, base station packet processors, and industrial controller cache where sustained throughput matters more than raw density.

167 MHz clock and 3.4 ns access — timing budget for the bus

At 167 MHz the cycle time is 6 ns. That split leaves a tight but workable margin for a 100 mm trace on a standard FR-4 board with one load per signal. If you are routing this to a FPGA or ASIC memory controller, factor the output hold time from the datasheet into your timing closure — the 167 MHz grade is the speed bin for designs that cannot tolerate a wait state on random access.

It reworks cleanly with a hot-air station at 260°C peak profile; the large body soaks heat evenly, so lifting a misaligned part without pad damage is routine.

For new designs this means no forced redesign cycle from obsolescence in the near term.

Frequently asked questions

Can CY7C1460KVE33-167AXI be used in extended temperature range applications?

It is not rated for extended range beyond 85°C or for automotive-grade qualification (AEC-Q100).

What package does CY7C1460KVE33-167AXI use?

It comes in a 100-LQFP package, with the supplier device package designation 100-TQFP (14x20 mm). The package is surface-mount with a 0.5 mm pitch and an exposed thermal pad.