It delivers a 3.4 ns access time at a 167 MHz clock, operating from a 2.375 V to 2.625 V supply. The parallel interface and wide word width target high-throughput applications such as network processor data buffers, telecom line-card packet memory, and DSP coefficient storage where back-to-back read-write cycles without dead cycles matter.
Supplied in a 165-ball FBGA (15 mm x 17 mm) — surface-mount only. The fine-pitch BGA requires controlled reflow profiling and X-ray inspection for voiding. No socket option exists for this footprint; plan for direct solder attachment to the PCB.