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Infineon Technologies CY7C1441KV33-133BZM — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1441KV33-133BZM 36Mbit SRAM, 133 MHz, 6.5 ns

MPNCY7C1441KV33-133BZM
End of Life

Infineon CY7C1441KV33-133BZM, 36Mbit synchronous SDRAM, 1M x 36 organization, 133 MHz clock, 6.5 ns access time, 3.135V–3.6V supply, -55°C to 125°C, 165-LBGA (15×17) surface-mount tray package.

$148.7150Ref. price · indicative, final on quote
Infineon Technologies CY7C1441KV33-133BZM datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1441KV33-133BZM specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Supply voltage3.135V ~ 3.6V
Clock frequency133 MHz
Memory interfaceParallel
Operating temperature-55°C~125°C(TC)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time6.5 ns
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 36

Product details

133 MHz synchronous SRAM with a 6.5 ns access window

It runs on a 133 MHz clock and delivers a 6.5 ns access time, which means the memory can sustain back-to-back reads at the full bus rate without wait states in most pipeline designs. The wide 36-bit word suits DSP engines, network processors, or any system that wants a single-chip data bus without byte-lane muxing.

The 3.135V to 3.6V supply rail keeps it compatible with 3.3V nominal systems while allowing margin during cold-crank or brownout conditions.

165-ball LBGA — footprint and handling

Housed in a 165-ball LBGA (15 mm x 17 mm body), the part is a surface-mount BGA. For high-volume reflow, check whether your assembly house can handle tray-fed pick-and-place or if a reel request is needed. The 1.0 mm ball pitch is standard for this density, but the BGA footprint demands careful PCB layout for signal integrity at 133 MHz.

Infineon lists the CY7C1441KV33-133BZM as Active.

Frequently asked questions

Does a pin-compatible second source exist for the CY7C1441KV33-133BZM?

No cross-reference or second-source alternate is cited in this ledger. The sourcing path is an RFQ into the allocation chain — the part is EOL/HOT with no documented successor on this record. The correct move is to ask the supplier for the official cross-reference and verify footprint and timing compatibility against the datasheet before any rework commitment.

What documentation should I request before placing a PO on this EOL/HOT part?

Full RoHS/REACH declaration, mold compound UL94 flammability rating, date-code traceability to fab lot and country of origin, and the distributor's incoming test coverage report — full AC parametric at rated Vcc versus continuity and device-ID only. Given the counterfeit risk on aged Cypress FBGA SRAM, the test coverage question is a procurement gate, not a courtesy inquiry.