The Infineon CY7C1424AV18-250BZCT is a 36 Mbit synchronous DDR II SRAM organized as 4M x 9, clocked at 250 MHz, and packaged in a 165-ball FBGA (15x17 mm). The DDR II architecture eliminates dead cycles on the bus by transferring data on both clock edges, so a 250 MHz clock delivers an effective 500 MT/s data rate per pin.
Supply rail and temperature grade — the deployment envelope
If your application sees ambient above 70°C or below freezing, this temperature grade will not hold; you would need an industrial- or extended-range sibling in the same family.
Infineon (formerly Cypress) has ended production; there is no official last-time-buy window remaining. New- and surplus-stock procurement through independent distribution is the only channel. If your BOM still calls out this exact order code, the board is locked to this footprint and timing — verify the date code and bake profile per MSL before reflow, since surplus stock may have been in storage past the floor-life window.
Package and mounting — the 165-FBGA footprint
The 165-ball FBGA (15x17 mm) is a fine-pitch BGA — expect 0.8 mm or 1.0 mm ball pitch depending on the specific ball map. Surface-mount rework requires a hot-air profile, X-ray inspection for voiding and solder joint integrity, and a pre-bake if the moisture-sensitive level (MSL) rating has been exceeded. The Tape & Reel (TR) packaging is the shipping medium; the device itself is a bare BGA, not pre-taped.