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Infineon Technologies CY7C1418KV18-250BZI — Memory (DRAM / SRAM / Flash / EEPROM)
Infineon Technologies

Infineon CY7C1418KV18-250BZI DDR II SRAM, 36Mbit, 250 MHz

MPNCY7C1418KV18-250BZI
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Infineon CY7C1418KV18-250BZI, Synchronous DDR II SRAM, 36 Mbit (2M x 18), 250 MHz clock, 1.7-1.9 V supply, 165-FBGA (13x15 mm), -40 to 85°C.

$16.3200Ref. price · indicative, final on quote
CY7C1418KV18-250BZI datasheet
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MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

CY7C1418KV18-250BZI Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency250 MHz
Memory interfaceParallel
Operating temperature-40°C~85°C(TA)
PackageTray
TechnologySRAM - Synchronous, DDR II
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 18

Product details

What this DDR II SRAM delivers

The Infineon CY7C1418KV18-250BZI is a 36 Mbit synchronous DDR II SRAM organized as 2M x 18 bits, clocked at 250 MHz. This is a double-data-rate part — data transfers on both rising and falling clock edges, effectively doubling the throughput per pin compared to a single-data-rate synchronous SRAM. The 18-bit word width suits DSP pipelines, parity-protected memory buses, or any application where a narrow-wide data path is preferred over a full 36-bit bus.

Industrial temperature and supply range

Operates from -40°C to 85°C. Supply range is 1.7 V to 1.9 V.

Package and layout considerations

165-ball FBGA, 13x15 mm. Parallel interface at 250 MHz.

Lifecycle and sourcing

Frequently asked questions

What is the memory organization of CY7C1418KV18-250BZI?

The 36 Mbit SRAM is organized as 2M words by 18 bits — an 18-bit word width that fits DSP or parity-protected memory buses.

What package does CY7C1418KV18-250BZI use?

It comes in a 165-ball FBGA (13x15 mm) — a fine-pitch BGA requiring controlled-impedance PCB layout and X-ray inspection for reliable solder joints.