333 MHz DDR II SRAM for high-throughput pipelines
The CY7C1393KV18-333BZI: This is a volatile memory device in a 165-ball FBGA package (13x15 mm), surface-mount, intended for high-bandwidth applications such as network packet buffers, telecom line cards, and DSP scratchpads where zero dead cycles between read and write are essential. The DDR II interface transfers data on both clock edges, effectively doubling the throughput per pin compared to a single-data-rate SRAM at the same clock frequency.
No external level translation is needed when interfacing with a 1.8 V I/O bank.
