300 MHz DDR II SRAM — 18 Mbit in a 165-FBGA
The double-data-rate interface transfers data on both clock edges, effectively doubling the throughput per pin compared to a single-data-rate SRAM at the same clock.
Obsolete — the sourcing picture
Cypress (now part of Infineon) has ended production; there is no listed official successor order code in the record.
At 300 MHz the DDR II interface delivers a 600 MT/s data rate per pin. The memory controller must close timing with a 1.7 ns clock period and half-cycle setup/hold windows. Board-level signal integrity — trace impedance, stub length, and VTT termination — becomes critical at this speed. The 1M x 18 organisation gives an 18-bit data bus, typical for networking packet buffers or high-speed data acquisition where a narrow but fast bus feeds a wide internal pipeline.
No separate VDDQ is needed. The low voltage reduces dynamic power but also narrows noise margins — a clean, well-decoupled 1.8 V plane with tight regulation is expected.
Package and footprint — 165-FBGA (13x15 mm)
The same ballout is shared across the CY7C1393JV18 family's speed grades, so a board designed for the 250 MHz variant can accept the 300 MHz part without a layout change.